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矽奈米模具 – HO600PM-D400

型號
HO600PM-D400
製造地
台灣
供應商
達慧科技股份有限公司
請求報價

主要特徵

l Silicon mold
       n High quality and precise flat of single crystal silicon (wafer) is fabricated byadvanced lithography and plasma etch.
       n As manufactured in modern FABs, the mold is completely ready for industrial usage.
l Pattern Profile
       n Defined by plasma etch, the quasi vertical profile is preciselycontrolled to moderate depth.
       n Convex: pillar or line
       n Concave: hole or trench
l Silicon Mold Wafer specification
       n <100> P-Type (8.5~11.5)
       n Diameter: 200 mm
       n Thickness: 725 um
       n Pattern edge exclusion: 3 mm
l Lithography Process
       n Shot field size = 21000 x 21000 um2
       n No. of Shot > 60 to cover all wafer area
       n Nearly seamless exposure
       n Alignment Accuracy = 200nm


l 8-inch Silicon Mold

       n   Please refer the [Silicon Mold - General Information]
l Mold Pattern
       n Hexagonal Pillar Array, Pitch = 600 nm
       n Design Pattern
                ▬   Width(Hole) = 300nm, Space = 300 nm
       n Depth = 400 nm
l Process Type: Premium








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最近更新 : 2018-04-20
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Silicon Mold – HO600PM-D400矽奈米模具 – HO600PM-D400
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